Semiconductor Back-end Process
Semiconductor back-end process consists of wafer mounting, die bonding, wire bonding, and packaging. The components can get stuck to the tools duiring taping, cutting and bonding process, result in defects and reduced productivity. The MiCC® coating forms a protective layer on the backend tools’ surface with low surface energy and low friction coefficient providing smooth release. The high hardness property also allows the mould to be resistant to deformation and scratch damage during repeated cleaning process. This greatly extend tools’ lifespan, reduce cleaning frequency and improve productivity.
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