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User Friendly
Control PanelEasy to operate and control
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Automotive
RoutinesFor pumping, venting and interlock monitoring
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Plasma
EtchingWide material compatibility
Easy to operate and control
For pumping, venting and interlock monitoring
Wide material compatibility
Configuration | Description |
Chamber Internal Dimension | Ø 0.24 x 0.2 m |
Chamber Material | SUS 304 |
Substrate Loading | Manual Sliding |
Reactor Type | Cavity Chamber Reaction |
Vacuum Range | 4 - 120 Pa |
Etching Time | ≈ 15 min for 100 nm (May vary for different shapes and sizes) |
Gas Channel | 2 Channels with Mass Flow Controllers |
Process Gas Type | O2 |
Purge Gas | N2 |
System Vent Gas | N2 |
System Dimension | ≈ 0.6 (L) x 0.8 (W) x 2.0 (H) m |
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